Marangoni dryer with hot N₂
Configuration with heated nitrogen. Process parameters are matched to the substrate and rinse process.
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Controlled drying as a critical step after wet cleaning.
Method and equipment size matched to production needs.
Drying tailored to the surface and substrate material.
Handling and interfaces matched to the wet process.
Drying parameters matched to process requirements.
Support and processing take sensitive substrates into account.
Drying after wet processing is critical for surface quality. The appropriate method depends on substrate, residual liquid, throughput and cleanliness requirements.
Explore the qSPRINT process platform
Drying processes tailored to surfaces, substrate materials and handling.
Explore materials & substratesFrom research and development to industrial manufacturing.
Drying after cleaning and rinsing.
Drying processes for semiconductor wafers.
Removal of residual liquids from substrates.
Process development and validation.
Integration into production workflows.
Configuration with heated nitrogen. Process parameters are matched to the substrate and rinse process.
Substrates are lifted from the rinse bath at a controlled rate. The Marangoni effect helps remove the liquid film.
Temperature and airflow are configured for the load and substrate geometry.
Drying takes place at reduced pressure. Pressure, temperature and cycle are configured for the application.
All variants can be built as standalone units. Their design draws on exateq’s experience integrating drying modules into automatic wet benches.
Options include Marangoni drying with hot N₂ or lift-out from the rinse bath, as well as hot-air and vacuum drying.
Yes, all variants can be configured as standalone units.
We help you select a drying method for your substrates and process sequence.