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Assembly unit for drying
WAFER & SUBSTRATE DRYING

Drying Systems for Wafers and Substrates

Controlled drying as a critical step after wet cleaning.

Drying tailored to your needs

Method and equipment size matched to production needs.

Removing residual liquids

Drying tailored to the surface and substrate material.

Process line integration

Handling and interfaces matched to the wet process.

Defined process conditions

Drying parameters matched to process requirements.

Gentle substrate processing

Support and processing take sensitive substrates into account.

EQUIPMENT OVERVIEW

Drying After Wet Processing

Drying after wet processing is critical for surface quality. The appropriate method depends on substrate, residual liquid, throughput and cleanliness requirements.

Explore the qSPRINT process platform
Drying module with open lid
Custom design for process requirements
Materials selected for chemical compatibility
Configurable process and operating functions
Exhaust and safety requirements considered
Integration into existing workflows
Optional automation and monitoring
Project-specific engineering and implementation

For Wafers, Substrates and Components

One system – many possibilities.

Drying processes tailored to surfaces, substrate materials and handling.

Explore materials & substrates

Related Products & Systems

Complementary solutions for your wet process.

Typical Applications

From research and development to industrial manufacturing.

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Post-clean wafer drying

Drying after cleaning and rinsing.

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Semiconductor processes

Drying processes for semiconductor wafers.

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Substrate drying

Removal of residual liquids from substrates.

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Research

Process development and validation.

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Pilot and volume production

Integration into production workflows.

Drying methods at a glance

Marangoni dryer with hot N₂

Configuration with heated nitrogen. Process parameters are matched to the substrate and rinse process.

Lift-out Marangoni dryer

Substrates are lifted from the rinse bath at a controlled rate. The Marangoni effect helps remove the liquid film.

Hot-air dryer

Temperature and airflow are configured for the load and substrate geometry.

Vacuum dryer

Drying takes place at reduced pressure. Pressure, temperature and cycle are configured for the application.

All variants can be built as standalone units. Their design draws on exateq’s experience integrating drying modules into automatic wet benches.

Frequently asked questions

Which drying methods does exateq offer?

Options include Marangoni drying with hot N₂ or lift-out from the rinse bath, as well as hot-air and vacuum drying.

Are the dryers available as standalone units?

Yes, all variants can be configured as standalone units.

PERSONAL CONSULTATION

Let’s discuss your drying process

We help you select a drying method for your substrates and process sequence.