What used to be a printed circuit is now integrated into a chip. Nonetheless, there are still highly-precision printed circuit boards, known as IC substrates. These consist of numerous interconnected layers that must exhibit uniform electrical and mechanical functionality. The increasingly fine structures push process capabilities to their limits - especially when aggressive chemicals act in tiny cavities and must then be removed in almost no time for a perfectly defined surface structure or layer. With panel sizes of up to 0.6 x 0.6 m² large wet benches are required compared to wafers processes. Such systems can reach lengths up to 40 m and consist of a large number of different chemical baths. These systems are fully automatic, even including certain process sequences and sections to clean the baskets. These baskets hold the panels in place during mechanical treatment inside the baths as well as during rapid immersion, removal, and transfer between the individual process stages.